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Thermal Printhead - メーカー・企業と製品の一覧

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[English Market Research Report] Global Market for Thermal Print Heads

[English Market Research Report] Global Market for Thermal Print Heads

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The global thermal print head market size is expected to grow from 90 million units in 2021 to 120 million units by 2025, with a CAGR of 7.4% from 2022 to 2025. The increase in hospital visits, the rise in the number of hospitals, and the trend towards digital or cashless payments are anticipated to drive market growth. This report investigates the global thermal print head market, providing comprehensive information on market dynamics, market analysis, competitive landscape, and more.

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Thermal print head

Thermal print head

We provide thermal print heads suitable for realizing your printing needs!

Our "Thermal Print Head" supports both face-down bonding method, which combines high reliability and high productivity with a drive IC mounting method, and wire bonding method, which enhances design flexibility. We can flexibly customize to meet various requests. Thanks to our in-house integrated production system, we can adapt to various applications by selecting from a wide range of glaze shapes, resistance values, and types of protective films. 【Features】 ■ Supports face-down bonding method and wire bonding method ■ In-house integrated production system from the core material, ceramic substrate, to the completed head ■ Adaptable to various applications through a wide selection of glaze shapes, resistance values, and types of protective films ■ The head shape can also accommodate flat types, edge types, corner edge types, and peripheral component mounting such as brackets according to requests *For more details, please refer to the related links or feel free to contact us.

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  • Printed Circuit Board

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